DuPont has announced that its DuPont™ Pyralux^® ML Series of double-sided metal-clad laminates has received the 2025 NPI Award in the Laminates category. The NPI Award, presented by Circuits Assembly, a publication run by PCEA (Printed Circuit Engineering Association), recognizes the most innovative and leading new products within the electronics assembly industry, including equipment, materials, and software, as judged by an independent panel of practicing industry engineers.

Launched in April 2024, Pyralux^® ML laminates are a unique addition to the extensive family of Pyralux^® laminates for flexible and rigid-flex printed circuit boards (PCBs). Developed for optimal thermal management, these laminates are an ideal solution for high-reliability markets such as aerospace, defense, electric vehicles (EVs), artificial intelligence (AI)-related networking, and other electronic devices. The Pyralux^® ML laminate series provides exceptional performance in challenging environments, making it a versatile and innovative solution for many different applications.

Evaluations were based on a variety of criteria including creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, performance, user-friendliness, and speed/throughput. DuPont's trailblazing Pyralux^® ML laminates contain metal alloys, such as copper-nickel (CuNi), featuring Kapton^® all-polyimide dielectric technology. The alloys provide optimized resistivity for higher heat output, reduced thermal conductivity for better control of heat transfer, and thermoelectric properties as needed for the application.

"I'm thrilled that our Pyralux^® team has been recognized for their tremendous work on this innovative technology," said Thean Ming Tan, Global Business Director, Advanced Flex Technologies, DuPont Interconnect Solutions. "Pyralux^® ML is proving to be the premiere product for optimizing thermal management, a key performance factor for industries with high-performance, high-reliability requirements including aerospace, defense, and critical industrial applications. Receiving this honor from a panel of industry experts underscores the value our products provide for our customers."

To learn more about DuPont™ Pyralux^® ML Series and other offerings, visit DuPont Interconnect Solutions at the IPC APEX Expo. The company will exhibit and present PowerChats in the Insulectro Technology Village, Booth 4138, and will share Booth 3916 with Tritek Circuit Products.