Assembly Excellence

Item

PCBA Capability

Lead Time

Regular prototyping orders are typically completed within 1–2 days. 

Small batch orders require approximately 3 days, with an expedited service option available for completion within 24 hours. 

Medium batch orders take 5 days or more, depending on complexity and volume. For long-term or recurring demands, we recommend scheduling delivery in advance to ensure timely fulfillment.

Remark: Lead times are calculated starting from the receipt and verification of all necessary materials and documentation, including the PCB, components, Bill of Materials (BOM), CAD files, Gerber files, and any additional design drawings.

PCBA SMT+DIP Equipments

Five Siemens high-speed, high-precision Surface-Mount Technology (SMT) production lines, designed for efficient and accurate component placement. 

Three Dual In-line Package (DIP) production lines with automated wave-soldering capabilities, supplemented by two manual soldering lines for specialized tasks. 

Three dedicated assembly and testing lines to ensure seamless integration and quality validation of finished products.

PCBA Capacity

SMT Capacity: Up to 10 million solder points per day, supporting high-volume production needs. 

DIP Capacity: Up to 180,000 solder points per day, accommodating through-hole assembly requirements.

Design Flexibility: Capable of handling 30–50 unique designs daily, catering to diverse project specifications.

Components Service

Turnkey

CYBERPCB leverages an established and trusted network of suppliers to source high-quality components at competitive prices, providing a comprehensive solution from procurement to assembly.

Kitted or Consigned

Customers may supply all components, and we handle the assembly process. To ensure compatibility with our equipment and maintain quality standards, components must be packaged in tubes, tapes, trays, or reels suitable for automated assembly.

Partial Turnkey

Customers provide key components, while we procure the remaining items as needed, offering a flexible and collaborative approach to production.

PCBA Solder Type

Supports Surface-Mount Technology (SMT), Through-Hole Technology (THT), and single- or double-sided Pick-and-Place (PnP) assembly to meet varied design requirements.

Solder Paste/Tin Wire/Tin Bar

Both leaded and lead-free (RoHS-compliant) soldering options are available, ensuring compliance with environmental standards and customer preferences.

Stencil

High-precision laser-cut stencils are utilized to optimize solder paste application, delivering excellent printing performance for fine-pitch Integrated Circuits (ICs), Ball Grid Arrays (BGAs), and assemblies meeting or exceeding IPC Class 2 standards.

MOQ

No MOQ is required for customers engaged in research and development (R&D), providing flexibility for prototype and experimental projects.

Component Size

Minimum Package

Supports 01005 chip sizes for ultra-small component assembly. 

Minimum BGA Spacing

0.3 mm (ball-to-ball), ensuring precision in high-density layouts. 

Minimum Fine Pitch

0.25 mm, with X-ray inspection available to verify solder joint integrity.

Component Package

We accommodate components packaged in tape-and-reel, tubes, and trays, ensuring compatibility with our automated assembly processes.

Maximum Mount Accuracy of Components (100FP)

Achieves a placement accuracy of ±50 μm, guaranteeing precision for high-density and fine-pitch components. 

Solderable PCB Types

Compatible with Rigid PCBs, Flexible Printed Circuits (FPCs), Rigid-Flex PCBs, and Aluminum PCBs, offering versatility across a wide range of applications.

PCB Size

Minimum PCB Size: 50 mm x 50 mm (smaller boards will be panelized for efficient processing).

Maximum PCB Size: 350 mm x 1200 mm, accommodating large-scale designs.

Testing and Coverage

We implement a comprehensive suite of testing procedures during and after assembly to ensure product quality prior to shipment.

IQC (Incoming Quality Control)

Inspects incoming materials to reject defective items, minimizing production risks.

SPI (Solder Paste Inspection)

Monitors solder paste application in real time, assessing height, area, and volume to detect issues such as solder bridges, insufficient or excessive solder, and irregular shapes. 

Online AOI (Automated Optical Inspection)

Evaluates soldering quality and component polarity across all parts, with 3D AOI capabilities to identify subtle defects like lifted QFP pins.

SMT Sample Inspection (FAI)

Conducts First Article Inspection (FAI) against BOM and Gerber data to confirm correct component placement and prevent defects from advancing to subsequent stages.

IPQC (In-Process Quality Control)

Performs in-process verification of SMT and DIP production, ensuring consistency and quality at every step.

Offline AOI Inspection

Identifies defects such as incorrect components, missing parts, or polarity errors post-assembly.

X-Ray Inspection

Examines hidden solder joints (e.g., BGA, QFN) for high-precision components, ensuring reliability where visual inspection is insufficient.

Functional Testing

Customers may provide test programs and methods, which we will execute as specified.

We strongly recommend functional testing, particularly for large-scale production, to validate performance and eliminate defects before shipment.

Repair & Rework

We provide expert repair and rework services to address soldering defects, ensuring that all products meet quality standards before delivery.